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RRP Electronics Ltd.

COMPANY NAME RRP ELECTRONICS LIMITED
NATURE OF BUSINESS SEMICONDUCTORS (OSAT & FABRICATION)
ISIN NO INE0UJK01018
FACE VALUE Rs.10/-
PROMOTERS RAJENDRA CHODANKAR (FOUNDER), SACHIN TENDULKAR.
COMPANY WEBSITE www.rrpelectronics.com
YEAR OF ESTABLISHMENT 2024
REGISTERED ADDRESS A396/397, TTC MIDC, MAHAPE, NAVI MUMBAI, THANE, MAHARASHTRA – 400710.

BOARD OF DIRECTORS

Mr. RAJENDRA CHODANKAR (CHAIRMAN & FOUNDER)
Mr. ANAY RAJENDRA CHODANKAR (MANAGING DIRECTOR)
Ms. KHUSHBU GUPTA (COMPANY SECRETARY)
Mr. GAJANAN VINAYAK GODBOLE (DIRECTOR)

RRP Electronics Limited is India’s pioneering Semiconductor Company and the first to establish a state-of-the-art OSAT (Outsourced Semiconductor Assembly and Test) facility in Maharashtra. The company gained significant global attention in 2024-2025 following a strategic investment from cricket legend Sachin Tendulkar.

The company announced a massive Rs. 12,000 Crore investment to set up a comprehensive semiconductor "Fab" (fabrication) campus in Navi Mumbai, spanning 100 acres. The company operates at the heart of India's Semiconductor Mission, focusing on reducing dependency on global supply chains. RRP has secured exclusive IP rights and technology transfers from major partners in Taiwan and the UK.

Historically, the brand expanded its market presence by taking over the listed entity The Indian Link Chain Manufacturers limited, effectively transitioning a legacy industrial firm into a high-tech electronics powerhouse.

The company is strategically positioned within the "Make in India" and "Aatmanirbhar Bharat" frameworks. It has secured critical technology transfer licenses (TTLA) from global giants like Deca Technologies (USA) and partners in Taiwan and Switzerland. With the backing of cricket legend Sachin Tendulkar as a strategic investor, RRP Electronics has transitioned from its legacy roots in industrial chains into a high-tech powerhouse focused on reducing India’s dependence on imported microchips.


Products of Company

  • OSAT Services: High-volume assembly, testing, and packaging of semiconductors, including QFN and BGA packages.
  • Automotive Chips: Specialized semiconductors for Electric Vehicles (EVs), battery management systems, and smart dashboards.
  • Thermal Imaging Sensors: High-tech sensors for medical diagnostics and Defense applications.
  • 5G/6G Infrastructure: Manufacturing of high-speed, low-latency network processing chips in collaboration with Kleos.
  • Memory Modules: Production of high-performance NVM (Non-Volatile Memory) and TFT LCD/OLED touch panels.
  • NAND Flash & Memory Modules: Production of memory chips for consumer electronics and industrial data storage.
  • ASIC Production.
  • Fingerprint Sensor Modules.
  • Wafer Level Packaging (WLP).

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